Molded Lead Frames

As MEMS packaging becomes more sophisticated with the advancing semiconductor technology, customers can rely on Unisteel in providing MEMS packaging solutions to meet these complex requirements.

Unisteel is capable of offering custom lead frame molding using specially formulated liquid crystal polymer (LCP) and other thermoplastic materials. Utilizing only substrate-based etched lead frames that have been plated with nickel-palladium-gold (NiPdAu) technology, we are able to mold a variety of thermoplastics onto lead frames to form customized cavity substrates for electronic packaging. Our pre-molded packages include QFN, PDIP, SOIC and SSOP.

Design Guideline for QFN

  • Minimum QFN molded lead frame height: 0.20mm
  • Dam wall thickness: 0.5mm (depends on sawing blade thickness)
  • Maximum lead frame length: 250mm
  • Maximum length of internal lead: 1.5mm
  • Minimum width between the internal lead: 0.2mm

Features & Benefits

  • Available in molded array packaging (MAP) and punch singulated (PS) configurations
  • Protects against moisture and other contaminants for near-hermetic applications
  • 65% to 85% reduction in footprint compared to SOIC packages
  • Superior thermal performance due to exposed lead frame
  • Thin and lightweight
  • Economical


  • MEMS device packages for smartphones and automotives
  • CMOS image sensor packages
  • Encoders
  • Other consumer device packages